Hottest tech shows the latest tip on Intel IDF 201

  • Detail

Tektronix showed the latest cutting-edge testing solutions at the 2011 Intel IDF

Intel Information Technology Summit, Beijing - April 12, 2011 - Tektronix, a leading manufacturer in the global oscilloscope market, recently announced that it would show the latest testing solutions and enhancements at the 2011 Intel Information Technology Summit (IDF) held at the National Convention Center of China from April 12 to 13. The technology package nitrogen and oxygen for future high-speed data innovation displayed this time have a degree of freedom of about 70nm, including Tektronix's end-to-end PCI Express 3.0 solution from protocol layer to physical layer, the latest BERTScope USB3.0 automation from manufacturer to service provider consistency test solution, and the latest mso/dpo5000 series oscilloscope, It provides an ideal tool for Embedded designers who develop applications based on the micro structure platform of Intel Atom processor family

high speed data designers are facing increasing pressure to keep up with the development of the latest standards and improve the design to a new level at the first time. This brings great testing challenges, and its difficulty and complexity are far higher than the previous level. As a partner of Intel, tech has been actively participating in IDF for many years. Tektronix will once again bring its unparalleled technical solutions to the 2011 IDF conference to introduce and demonstrate its perfect test and measurement series tools on site, so as to help design engineers launch the next generation of products to the market on schedule

from the protocol layer to the physical layer, it provides a single tool solution for PCI Express 3.0.

Tektronix logic protocol analyzer provides the best solution of both protocol analyzer and logic analyzer for the design, testing and debugging of PCI Express 3.0. The test challenges in PCI express may come from any layer of the PCIe protocol stack, including the reliable and stable operation of the transport layer or the physical layer. In the past, engineers needed an oscilloscope and a protocol analyzer to perform necessary tests. Tla7saxx series logic analyzer for PCI Express 3.0 is a single tool that can cover protocol layer to physical layer at the same time. It can help system engineers, hardware engineers and software engineers to conduct collaborative debugging, and can quickly determine system level problems. In order to enhance the ability of tla7saxx to view the physical layer, tech adopts OpenEye technology in the system design. OpenEye provides automatic tuning and equalization function, which can evaluate the physical layer performance of PCI express channel more quickly without deep oscilloscope setting experience

adopt the options of BERTScope and bsausb3 to provide an automated receiver test solution for USB 3.0

high speed serial standards such as USB 3.0. Due to the improvement of data speed, it is necessary to test the physical layer characteristics of both transmitter and receiver. Engineers no longer rely solely on eye charts to judge performance, but need to use different tools. Tektronix's latest bsausb3 option, combined with an LFPs switch and automation software, provides an excellent way to make USB3.0 conformance testing easier and obtain consistent results. The bsausb3 option allows engineers to perform automated pressure eye calibration, loopback startup, and jitter tolerance tests, and at the same time provides a database back-end that can quickly generate reports. In addition, the excellent de emphasis and clock recovery module of BERTScope, combined with the powerful oscilloscope ability, can help engineers meet or even exceed the requirements of conformance testing

dpo/mso5000 series provides incomparable performance and analysis tools for embedded systems.

the dpo/mso5000 series oscillograph newly launched by Tech provides a bandwidth of 350 MHz - 2 GHz, providing test solutions for a variety of industries and applications. Consumer and industrial products are becoming more and more intelligent. They use more advanced embedded electronic devices, including a variety of components connected from chip to chip bus, wired and wireless network connections, complex power management schemes, image display, cutting-edge user interfaces (such as high-speed USB 2.0, Ethernet, DDR) and universal serial buses (such as I2C, SPI, can, Lin). Through the latest products, Tektronix has once again verified the close combination of its products and the industry's continuous development of residual internal stress in the extruded layer organization and the continuous improvement of demand, helping engineers based on Intel Atom processor micro structure and other platforms to develop more complex design applications

about Tektronix

for more than 60 years, engineers have been seeking test, measurement and monitoring solutions from Tektronix to meet design challenges, improve production efficiency and significantly shorten the time to market. Tektronix is a leading supplier of testing instruments, providing support to engineers who focus on electronic design, manufacturing and advanced technology development. Headquartered in Beaverton, Oregon, the United States, tech provides award-winning services and support to customers worldwide. To obtain cutting-edge technology, please log in

Copyright © 2011 JIN SHI